Samsung today announced that it has started the mass production of the Exynos 7 Quad 7570 chip based on its 14nm FinFET process. The latest mobile AP from the company is being targeted for use in budget smartphones and IoT devices.

The Exynos 7570 is among the very few budget APs in the market that is based on the 14nm fabrication process. This will allow the chipset to offer better performance whilst consuming less power and remaining cooler. The chip comprises of four Cortex-A53 cores that are up to 70% faster and 30% more power efficient compared to their predecessor.

Samsung says that its Exynos chip is also the first to come with an integrated Cat.4 LTE 2CA modem and other connectivity features like Wi-Fi, Bluetooth, GNSS, and FM in one chip.

“With Exynos 7570, more consumers will be able to experience the performance benefits of the advanced 14nm FinFET process in affordable devices,” said Ben K. Hur, Vice President of System LSI Marketing at Samsung Electronics. “By successfully integrating various connectivity solutions, Samsung is strengthening its competitiveness in the single chip market”

By integrating the modem directly into the chipset, Samsung will be able to further reduce the overall power consumption even further. The chip is also 20 percent smaller thanks to design optimisations and component feature consolidation.

The Exynos 7570 chip supports up to WXGA screen resolutions and cameras of up to 8MP/13MP resolution. It is also capable of recording and playing back Full HD videos. It is likely that we will see Samsung use its Exynos 7570 chipset in some of its upcoming budget smartphones meant for the Asian and European market.