Samsung announced today that it has started the mass production of ‘advanced logic chips’ based on the 14nm LPP (Low-Power Plus) fabrication process. This is the second generation of the company’s 14nm FinFET process that was used to fabricate the Exynos 7420 last year.

Most importantly though, Samsung also confirmed in its announcement that it would be fabricating Qualcomm’s latest and greatest Snapdragon 820 chipset on its 14nm LPP process. The Snapdragon 820 chipset from Qualcomm will power a majority of flagship devices that will be released in the first half of 2016. This will be the first time that Qualcomm has fabricated its chips through a Samsung foundry. The company has previously relied solely on TSMC to fabricate its chips, but the process advantage that Samsung had over TSMC this time around, likely led Qualcomm to take this decision.

Samsung boasts that its second-generation 14nm LPP process offers up to 15 percent higher clock speeds while reducing power consumption by similar levels.

With the Snapdragon 810 chipset from Qualcomm suffering from overheating issues last year due to poor optimisation and 20nm fabrication process, it makes sense for the company to go for Samsung’s mature and more advanced 14nm LPP fabrication process for the Snapdragon 820 compared to TSMC’s 16nm FinFET process.

Samsung is also rumored to equip at least some models of the Galaxy S7 with a Snapdragon 820 chipset, so this move will benefit the company as well.