After bagging a contract to manufacture a certain share of Qualcomm’s Snapdragon 820 chipset on its foundries for 2015, Samsung has reportedly bagged the contract to manufacture Qualcomm’s Snapdragon 830 chipset on its 10nm fabrication process for next year.

Samsung LSI will be manufacturing Qualcomm’s upcoming high-end Snapdragon 830 chipset on its foundries.Samsung itself will also be using its 10nm fabrication process for its upcoming Exynos 8895 chipset. The company’s upcoming Galaxy S8 is expected to make use of both Snapdragon 830 and Exynos 8895 chipsets.

Samsung and Qualcomm will be working closely to develop FoPLP (Fan-out Panel Level Package) for their Snapdragon 830 and Exynos 8895 chipsets. This technology will allow the companies to eliminate using a PCB for the package substrate that will reduce the cost of production and make the overall package thinner.

The 10nm fabrication process should make the Snapdragon 830 more power efficient and run cooler than even the Snapdragon 820. Qualcomm had previously solely relied on TSMC for fabricating its chipsets, but last year, the company for the first time placed some orders with Samsung for fabricating its chipsets as well.

Qualcomm has been facing stiff competition in recent times from various companies after dominating the smartphone chipset market for years. Samsung’s Exynos chipsets have turned out to be a formidable competitor to Qualcomm’s Snapdragon offerings and Apple despite not being a chip first company has been able to handily beat Qualcomm’s flagship chipsets with its A-series chips every year.