A report originating from China claims that Samsung is actively looking for heat pipe suppliers for the Galaxy S7. The company is apparently already testing various configurations and designs of the heat pipe from various component manufacturers. 

The Korean smartphone maker has been forced to take this decision due to the overheating issues plaguing the Snapdragon 820.

The overheating issues with Qualcomm’s current generation Snapdragon 810 chip led Samsung to use its in-house Exynos 7420 chipset on the Galaxy S6 and Note 5. For the Galaxy S7 though, the company intends to launch at least some variants of the handset that will be powered by a Snapdragon 820 chip. As rumors have indicated though, the chip also suffers from overheating issues, which has led Samsung to look for potential heat pipe suppliers for its 2016 flagship.

Samsung has not yet finalised on a heat pipe design and is currently experimenting with them to find the ideal solution. The report also claims that Samsung will take a final decision on whether to use a heat pipe inside the Galaxy S7 or not by the end of this year.

There is still a chance that the Qualcomm will be able to tame the overheating issues of the Snapdragon 820 in time for Samsung to not use a heat pipe inside the Galaxy S7. Do you think Samsung should use a heat pipe inside the Galaxy S7 even if the Snapdragon 820 chip inside it does not overheat as much as Snapdragon 810?