Rumors about Qualcomm’s upcoming chipset — the Snapdragon 810 — overheating have been frequently popping up on the Internet now.

In fact, a report from earlier this week suggested that the overheating issues have even led Samsung to drop Qualcomm’s Snapdragon 810 in favor of its own Exynos chipset on the Galaxy S6.

However, one of LG’s executives states that the Snapdragon 810 is performing just fine and that there are no overheating issues with it. At a press conference to unveil the G Flex 2, Woo Ram-Chan, vice president of mobile product planning at LG, said that he is “very much aware of the various concerns in the market about the (Snapdragon) 810, but the chip’s performance is quite satisfactory.”

He further added that in LG’s testing, the Snapdragon 810 heated less than the existing products in the market.

“I don’t understand why there is a issue over heat,” he said.

LG’s G Flex 2 was the first handset to be announced with Qualcomm’s Snapdragon 810 chipset and it is more than likely that it will be the first to the market as well.

The Snapdragon 810 is Qualcomm’s first high-end 64-bit chipset and packs in four low-power Cortex-A53 cores and four high-performance Cortex-A57 cores in big.LITTLE architecture to deliver the best of both battery life and performance.

Any delay from Qualcomm on launching the Snapdragon 810 can spell trouble for HTC and other OEMs, since they are all relying on Qualcomm’s latest chipset to power their high-end devices. However, with LG and even Xiaomi already announcing phones with a Snapdragon 810 processor, it looks like the overheating issues plaguing the Snapdragon 810 have been greatly exaggerated.