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The HTC One M9 has been torn down by the folks over at iFixit, and has received a poor repairability score of 2 out of 10.
The One M8 had also received the exact same score from iFixit last year, so this should not really come as a surprise. Just like its predecessor, the One M9 comes with a unibody metal finish that makes it hard to access the internals of the handset. However, things have become substantially easier since the launch of the original One M7 in 2013.
All the extra shielding that was found on the M8 last year is nowhere to be found on the M9 this time around, which makes it easier to dismantle each internal of the phone.
The teardown also gives us a clear look at the Snapdragon 810 chipset from Qualcomm, the 32GB eMMC NAND flash from Samsung, Broadcom’s Wi-Fi module, Silicon’s image transmitter for MHL 3.0 and more.
In the end though, iFixit states that replacing the battery or the display on the One M9 is extremely hard. Replacing the display, for example, will requires users to tunnel through the entire phone, which makes the whole process very tedious and risky.
[Via iFixit]
