Chinese analyst Jiutang Pan has revealed key specifications of Qualcomm’s next-generation chipset — the Snapdragon 820. 

With Qualcomm’s high end chip for 2015 — the Snapdragon 810 — being plagued with overheating issues, expectations are sky high from the company to bounce back with its next-generation Snapdragon chipset that will feature its own custom cores. The chip maker has not revealed any details about the Snapdragon 820, but thanks to some leak slides from Chinese analyst Jiutang Pan, key specifications of the chipset have now been revealed.

According to the slides post by Pan through his Weibo account (China’s Twitter), the Snapdragon 820 is going to be a quad-core chip that will feature the company’s custom 64-bit ‘Hydra’ cores based on the 14nm FinFET process for “better active power, faster peak CPU” performance. The slides mention an improvement of nearly 35 percent over previous generation chips, while the Adreno 530 GPU inside the chip is up to 40 percent more powerful but still consumes 30 percent less power than its predecessor.

Other key features of the chipset include a 14bit dual ISP, the ability to record 4K videos at 60FPS, support for dual channel LPDDR4 RAM, USB 3.0 and eMMC 5.1 interface, and a “programmable pre/post processing DSP for further camera differentiation” between OEMs.

The new chipset will also come with a new envelop tracker (QFE3100) with lower power and thermal footprint. In addition, the chipset will also come with a dedicated low-power sensor for “emerging always-on use-cases with 512KB.”

Another set of rumours claim that Qualcomm has finished the first samples of the Snapdragon 820 chips and has sent them to certain OEMs for testing. The company is reportedly planning on unveiling the chipset on August 11th at a press conference in Los Angeles, though the chipset is not expected to show up in premium Android phones before next year.